PRODUCT
製品販売半導体製造用装置
Semiconductor Processing Equipment
Wax Mounter for up to 12-Inch Wafers (Product Name: TEC-1001MB)
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The wafer wax mounting process is an important process that can greatly affect the wafer's polishing condition and the precision of the wafer's thickness. This is a specialized wafer wax mounter for the realization of high quality grinding and polishing processes.
Features
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- Mounting Condition Controls
- Adjustable settings for pressure, temperature and time to suit the properties of the wafer, and limit the damage to the device.
- Uneven Wax Application Prevention
- Through optimization of the heating and cooling processes, and high stability function design, our machine realizes an even heat distribution and stable load distribution to prevent unevenness in the wax thickness that would affect the accuracy of subsequent processes.
- 12-Inch Wafer Support
- Supporting wafers with a maximum diameter of 12 inches; in addition to the standard sapphire, SiC, GaAs, GaN, InP, Si wafers, the machine can also be used with other compound wafers and various works.
Primary Specifications
- Wafer Wax Mounting Section
- Applicable Plate Size
- ⌀180-⌀320mm, thickness: 5-30mm
- Heating/Cooling Setting Temperature range
- Room temperature - 160℃
- Setting Units
- 1℃
- Temperature Distribution Accuracy
- Within±5℃
- Temperature Control Accuracy
- Within±3℃
- Wafer Compression Section
- Setting Units
- 1kPa
- Maximum Pressure
- 300kPa
Size (Width x Depth x Height)
650mm x 850mm x 1833mm
For any product questions/enquiries, please use the product form linked below.
To the product form